Ceramic Lids for Hermetic Microelectronic Packages

Ceramic Lids for Non-magnetic Hermetic Microelectronic Packages

Ceramic Lids are used primarily with Cerquad packages that require a glass or B-staged epoxy coated seal. 

ceramic lids

Ultra thin, enabling devices to become smaller in size, lower in height. These lids are used on various multilayer packages where temperature constraints after die attach require a low temperature lid seal. 

Hermetic and non-hermetic ceramic lids for semiconductor, MEMS, medical or optical requirements.

ceramic seal

Ceramic Lids Features

  • Available in a wide variety of shapes, sizes and thickness

  • Low tempearture epoxy or glass seal

  • Solid or window options

  • Marking permanency

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