- XMCERA
- XIAMEN
- 45 DAYS
- 1000PCS
Aluminum Nitride Ceramic Heater has properties of high thermal conductivity, excellent heat equalization and electrical insulation. ALN ceramic heater is widely used for semiconductor manufacturing devices, and it can be used for vacuum evaporation system(VES), sputtering machines and CVD devices.
Aluminum Nitride Ceramic Heater
Aluminum Nitride Ceramic Heater
Aluminum Nitride Ceramic Heater has properties of high thermal shock resistant, high thermal conductivity and electrical insulation. ALN ceramic heater is widely used for mainly semiconductor processing, and it can be used for vacuum evaporation system(VES), sputtering machines and CVD devices.
About Aluminum Nitride Ceramics
Aluminum Nitride (AlN) Ceramics is an excellent ceramic material to use if high thermal conductivity and electrical insulation properties are required, making it an ideal material for use in thermal management and electrical applications.
Aluminum Nitride Ceramic Heater has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.
Aluminum Nitride Heater Multiple Configurations Available
• Plates
• Pedestals (plate hermetically bonded to shaft)
• Rings
• Custom applications
Various AlN Ceramic Heater Sizes Supported
• 150 mm
• 200 mm
• 300 mm
Options and Specifications
• Operating temperature up to 750 °C
• Single or multiple heating zones
• Embedded RF antenna or ground plane available
• Ramp rate 10-15 °C/minute
• Patented hot pressed, unibody technology
Properties of Aluminum Nitride Ceramics Heater
High thermal conductivity
Low coefficient of thermal expansion
Good electrical insulation and resistivity
Low dielectric constant
High mechanical strength under compression load
Corrosion resistant (gas)
Good thermal shock resistance
Applications of Aluminum Nitride Ceramics materials
Heat sinks & heat spreaders
Electrical insulators for lasers
Chucks, clamp rings for semiconductor processing equipment
Electrical insulators
Silicon wafer handling and processing
Substrates & insulators for microelectronic devices & opto electronic devices
Substrates for electronic packages
Chip carriers for sensors and detectors
Chiplets
Collets
Laser heat management components
Molten metal fixtures
Packages for microwave devices
Properties | Units | Value |
Color | Grey | |
Mechanical Properties | ||
Density | g/cm3 | 3.30 |
Modulus of Elasticity | GPa | 310 |
Fracture toughness | Mpa x m^1/2 | 3.5 |
Poissons Ratio | 0.25 | |
Compressive Strength | MPa | 2100 |
Flexural Strength | MPa | 335 |
Hardness (Knoop 100 g) | Kg/mm2 | 1170 |
Hardness (Vickers) | GPa | 11 |
Thermal Properties | ||
Maximum Temperature | ||
Oxidizing | °C | 700 |
Inert | °C | 1300 |
Thermal Conductivity | ||
@ 25°C | W/mK | 180 |
@ 300°C | W/mK | 130 |
Specific Heat | J/kg.K | 750 |
Thermal Shock Resistance ΔT | °C | 400 |
Coefficient of Expansion | ||
CTE 25°C ➞ 100°C | 10^-6/°C | 3.6 |
CTE 25°C ➞ 300°C | 10^-6/°C | 4.6 |
CTE 25°C ➞ 500°C | 10^-6/°C | 5.2 |
CTE 25°C ➞ 1000°C | 10^-6/°C | 5.6 |
Electrical Properties | ||
Dielectric Constant | 1 MHz | 8.6 |
Loss Tangent | 1 MHz | 5x10^-4 |
Dielectric Strength | kV/mm | >15 |
Volume Resistivity | ||
25°C | Ω cm | >10^13 |
300°C | Ω cm | 10^9 |
500°C | Ω cm | 10^7 |
Price and Lead Times We minimize your cost by assigning your part to the best and fastest XMCERA manufacturing system. Our machining service can handle almost all of the parts we receive from buyers like you, saving you money and shortening lead times. As we say, Quotes in hours. Parts in days. Often, we provide parts in as fast as one day! Consistency When you order prototypes from us, you ...more
