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Aluminum nitride (AlN) ceramic material was found to be promising in microelectronics applications, due to its very high thermal conductivity and property as an insulating ceramic.
High Thermal Conductivity Ceramic Crucible
Aluminum nitride (AlN) ceramic material was found to be promising in microelectronics applications, due to its very high thermal conductivity and property as an insulating ceramic.
Corrosion resistant of AlN ceramics and non adhesion with molten metal properties can be used for melting metals and the preparation of single crystal.
Aluminum nitride (AlN) ceramic material is also one of the selected materials to build crucibles for grow crystals of GaN (gallium nitride).
About Aluminum Nitride Ceramics
Aluminum Nitride (AlN) Ceramics is an excellent ceramic material to use if high thermal conductivity and electrical insulation properties are required, making it an ideal material for use in thermal management and electrical applications.
Aluminum Nitride Ceramic has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.
Properties of Aluminum Nitride Ceramics
High thermal conductivity
Low coefficient of thermal expansion
Good electrical insulation and resistivity
Low dielectric constant
High mechanical strength under compression load
Corrosion resistant (gas)
Good thermal shock resistance
Applications of Aluminum Nitride Ceramics
Heat sinks & heat spreaders
Electrical insulators for lasers
Chucks, clamp rings for semiconductor processing equipment
Electrical insulators
Silicon wafer handling and processing
Substrates & insulators for microelectronic devices & opto electronic devices
Substrates for electronic packages
Chip carriers for sensors and detectors
Chiplets
Collets
Laser heat management components
Molten metal fixtures
Packages for microwave devices
Properties | Units | Value |
Color | Grey | |
Mechanical Properties | ||
Density | g/cm3 | 3.30 |
Modulus of Elasticity | GPa | 310 |
Fracture toughness | Mpa x m^1/2 | 3.5 |
Poissons Ratio | 0.25 | |
Compressive Strength | MPa | 2100 |
Flexural Strength | MPa | 335 |
Hardness (Knoop 100 g) | Kg/mm2 | 1170 |
Hardness (Vickers) | GPa | 11 |
Thermal Properties | ||
Maximum Temperature | ||
Oxidizing | °C | 700 |
Inert | °C | 1300 |
Thermal Conductivity | ||
@ 25°C | W/mK | 180 |
@ 300°C | W/mK | 130 |
Specific Heat | J/kg.K | 750 |
Thermal Shock Resistance ΔT | °C | 400 |
Coefficient of Expansion | ||
CTE 25°C ➞ 100°C | 10^-6/°C | 3.6 |
CTE 25°C ➞ 300°C | 10^-6/°C | 4.6 |
CTE 25°C ➞ 500°C | 10^-6/°C | 5.2 |
CTE 25°C ➞ 1000°C | 10^-6/°C | 5.6 |
Electrical Properties | ||
Dielectric Constant | 1 MHz | 8.6 |
Loss Tangent | 1 MHz | 5x10^-4 |
Dielectric Strength | kV/mm | >15 |
Volume Resistivity | ||
25°C | Ω cm | >10^13 |
300°C | Ω cm | 10^9 |
500°C | Ω cm | 10^7 |
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